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Ball grid array
- Created 2012-03-12
ball grid array
) is a type of
packaging used for
s. BGA packages are used to permanently mount devices such as
s. A BGA can provide more interconnection pins than can be put on a
. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.
from Wikipedia (last updated: 24 May), licensed under
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Embedded Wafer Level Ball Grid Array
Land grid array
Pin grid array
Dual in-line package
Small-outline integrated circuit
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