A
ball grid array (
BGA) is a type of
surface-mount packaging used for
integrated circuits. BGA packages are used to permanently mount devices such as
microprocessors. A BGA can provide more interconnection pins than can be put on a
dual in-line or
flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.